
for detecting enameled round wire and wire harness solderability performance;
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Product description:
□ for detecting enameled round wire and wire harness solderability performance;
□ single-chip computer control;
□ soldering temperature can be set and automatic thermostat;
□ mechanical transmission automatically insert and remove the sample Sway
Applied standard:
Implementation of the standards: GB / T4074.4-2008 / IEC 60851-4: 2005;
inspection standards: JB / T4279.14-2008;
meet GB / T6109-2008 standard requirements
Technical parameter:
Solder tank capacity | > 500ml |
Solder component | Tin: lead = 60: 40 |
Solder Temperature indication error | <3 ℃ |
Timing device error | <1s |
Sample solder insert test time | (0~99)s set at random |
Sample insertion depth | 0~50mm set at random |
Input power | AC220V±10% 50HZ |
Power consumption | <1000W |
Work environment | Temperature:0-40℃;Humidity:≤85% |
Machine dimension | L×W×H 560×310×510mm |
Weight | 35kg |